Novel Materials and Devices for the Post-Moore Era
Full conference program coming soon
Times are displayed in CST
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Available On Demand
Keynote Talk
9:00 - 9:40 a.m.
Mark Hersam Northwestern University, USAMark C. Hersam is the Walter P. Murphy Professor of Materials Science and Engineering, Director of the Materials Research Center, and Chair of the Materials Science and Engineering Department at Northwestern University. He also holds faculty appointments in the Departments of Chemistry, Applied Physics, Medicine, and Electrical Engineering. He earned a B.S. in Electrical Engineering from the University of Illinois at Urbana-Champaign (UIUC) in 1996, M.Phil. in Physics from the University of Cambridge (UK) in 1997, and Ph.D. in Electrical Engineering from UIUC in 2000. His research interests include nanoelectronic materials, additive manufacturing, scanning probe microscopy, renewable energy, sensors, neuromorphic computing, and quantum information science. Dr. Hersam has received several honors including the Presidential Early Career Award for Scientists and Engineers, TMS Robert Lansing Hardy Award, MRS Mid-Career Researcher Award, AVS Medard Welch Award, U.S. Science Envoy, MacArthur Fellowship, and eight Teacher of the Year Awards. Dr. Hersam has been repeatedly named a Clarivate Analytics Highly Cited Researcher with over 700 peer-reviewed publications that have been cited ~80,000 times. An elected member of the American Academy of Arts and Sciences, National Academy of Engineering, and National Academy of Inventors with over 170 issued and pending patents, Dr. Hersam has founded two companies, NanoIntegris and Volexion, which are suppliers of nanoelectronic and battery materials, respectively. Dr. Hersam is a Fellow of MRS, ACS, ECS, AVS, APS, AAAS, SPIE, and IEEE, and also serves as an Executive Editor of ACS Nano.
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Available On Demand
Invited Talk
10:10 - 10:40 a.m.
Jing-Kai Qin Harbin Institute of Technology (Shenzhen), ChinaDr. Jing-Kai Qin is currently a full professor in School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, China. Before joining HIT faculty in 2020, he worked in Purdue University and the Hong Kong Polytechnic University. His current research work is focused on novel low-dimensional semiconducting materials and device integration. As the first and corresponding author, he has published more than 40 peer reviewed articles including Nature Electronics, Nature Communications, Progress in Materials Science, etc. He received various fellowships and awards such as IAAM Scientist Medal, IAAM Advanced Materials Award, Lam Research Fellowship.
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Available On Demand
Invited Talk
11:30 - 12:00 a.m.
Wenzhong Bao Fudan University, ChinaWenzhong Bao is a full professor in the School of Microelectronics at Fudan University. He reveived his PhD from the University of California, Riverside in 2011, where he studied in the Department of Physics and Astronomy. He subsequently held postdoctoral positions at the University of Maryland College Park from 2011-2014 and at King Abdullah University of Science and Technology from 2014-2015. His current research interests involve emerging 2D semiconductors and their applications in next-generation electrical, optoelectrical, and energy devices. He was awarded the 2016 International Union of Pure and Applied Physics (IUPAP) Young Scientist Prize (C10) and the 2017 Hong Kong Qiushi Outstanding Young Scientist Prize.
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Available On Demand
Invited Talk
1:30 - 2.00 p.m.
Yan Wang University of Cambridge, UKDr Yan Wang received her PhD from University of Cambridge in 2021 and become an independent PI at University of Cambridge in 2024. She is a research fellow at St John’s College at Cambridge. Her research focuses on developing ultra-low power electronics based on two dimensional (2D) materials. She develops innovative methods to study atomic interfaces using imaging, spectroscopic, and electronic techniques, leveraging these approaches to investigate how the interfaces of 2D materials affect the overall device performance.
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Available On Demand
Invited Talk
2:00 - 2:30 p.m.
Deep Jariwala University of Pennsylvania (Penn), USADeep Jariwala is an Associate Professor and the Peter & Susanne Armstrong Distinguished Scholar in Departments of Electrical and Systems Engineering and Materials Science and Engineering at the University of Pennsylvania (Penn). His research interests broadly lie at the intersection of new materials, surface science and solid-state devices for computing, sensing, opto-electronics and energy harvesting applications. Deep completed his undergraduate degree in Metallurgical Engineering from the Indian Institute of Technology, Banaras Hindu University in 2010. Deep went on to pursue his Ph.D. in Materials Science and Engineering at Northwestern University graduating in 2015. At Northwestern, Deep made contributions to the study of charge transport and electronic applications of two-dimensional (2D) semiconductors and their devices for which he was awarded the Johannes and Julia Weertman Doctoral Fellowship and the Hilliard Award of the department. Deep then moved to Caltech as a Resnick Prize Postdoctoral Fellow from 2015-2017 working on nanophotonic devices and ultrathin solar cells, before joining Penn in 2018 to launch his independent career. Deep’s research has earned him awards of multiple professional societies including the Adolph Lomb Medal of Optica (formerly OSA), the Peter Mark Memorial Award and Paul H. Holloway Award of the American Vacuum Society, The Richard L. Greene Dissertation Award of the American Physical Society, the Army Research Office and Office of Naval Research Young Investigator Awards, Nanomaterials Young Investigator Award, TMS Frontiers in Materials Award, Intel Rising Star Award, IEEE Photonics Society Young Investigator Award, IEEE Nanotechnology Council Early Career Award, IEEE Benjamin Franklin Key Award, IUPAP Early Career Scientist Prize in Semiconductors, the SPIE early career achievement award, the Alfred P. Sloan Fellowship in addition to being named in Forbes Magazine list of 30 scientists under 30 and is an invitee to Frontiers of Engineering conference of the National Academy of Engineering. In 2022, his work on ferroelectric diode memory was also awarded with the prestigious Bell Labs Prize worth 100000 $. In addition, he has also received the S. Reid Warren Jr. award and Undergraduate Research Mentoring award given to one faculty member every year at Penn Engineering for inspiring and motivating undergraduate students through teaching and research. He currently serves as an Associate Editor (AE) for ACS Nano Letters and has served as an AE for IEEE Photonics Technology Letters as well as npj 2D materials and applications in the past. He has published over 170 journal papers with more than 23000 citations and 10 patents. At Penn he leads a research group comprising more than ten graduate and postdoctoral researchers supported by a variety of government agencies (NSF, DARPA, ARO, AFOSR, ONR), industries and private foundations.
Google Scholar: https://scholar.google.com/citations?user=u1CHA2sAAAAJ&hl=en
Lab website: https://jariwala.seas.upenn.edu/
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Available On Demand
SESSION II: 2D and Emerging Materials: Integration and Large-Scale Manufacturing
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Available On Demand
Invited Talk
3:50 - 4:20 p.m.
Camilla Coletti Istituto Italiano di Tecnologia, ItalyCamilla Coletti is a tenured Senior Scientist of the Istituto Italiano di Tecnologia (IIT) and principal investigator of the research line 2D Materials Engineering. She is the coordinator of the Center for Nanotechnology Innovation of Pisa and of the Graphene Labs. Her research is currently focused on: (i) synthesis and integration of scalable 2D materials for electronics, photonics and quantum technologies (ii) engineering van der Waals heterostructures. In her work she applies her background of surface scientist to impact science and technology of 2D materials. She is the author of more than 200 peer-reviewed publications, contributed to several book chapters and holds 3 international patents.