Organized by Fudan University , Nature Sensors, Nature Nanotechnology, Nature Materials, Nature Electronics and Nature Reviews Electrical Engineering.

The conference will bring together scientists, engineers, and researchers from academia and industry to discuss how advances in layered and emerging materials are shaping the next generation of intelligent electronic systems. It will provide a forum to examine the pathway from fundamental materials science and device physics to scalable integration technologies and real-world applications, ultimately supporting the development of energy-efficient, adaptive, and intelligent hardware platforms for computing, sensing, and human–machine interaction.

Sessions will explore the full spectrum of research and innovation, from layered materials, novel device concepts, and advanced memory technologies to heterogeneous integration, 3D architectures, and manufacturable system designs. The conference will emphasize emerging paradigms including neuromorphic and in-memory computing, integrated sensing and processing, bioelectronics, flexible and wearable systems, and AI-enabled hardware. It will also highlight application-driven advances in healthcare, industrial technologies, and extreme-environment electronics, where innovations in materials, devices, and integration are enabling new functionalities and accelerating the translation of research into impactful technologies.  

Register Now Submit Abstract Deadline: Feb.14, 2027 Contact Us